Analysis on Welding Failure of Terminal Electrode of Multilayer Ceramic Capacitors by SEM Research of Silver Termination Electrode Paste for MLCC 基于SEM的MLCC端电极焊接失效分析多层陶瓷电容器端电极银浆料匹配问题的研究
As a newly developed welding material accompanied with SMT, solder paste plays a predominant role in the reliability of solder interconnection. The quality of the solder paste depends on the performance of solder powder and flux. 焊膏是伴随着表面贴装技术应运而生的一种新型焊接材料,对焊点的可靠性有决定性影响,焊膏的质量取决于焊粉与助焊剂性能。
In the Paper the optimization measures on hot air welding process are detailed. 1. The solder paste feeding automation. 论文详细介绍了热风焊工艺优化措施:1.锡膏进料的自动化。